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Package System

Embossed carrier tape

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Embossed carrier tape provides protection to integrate circuits and other devices from physical and electro-static discharge (ESD) damage during shipping and storage. Carrier tape is widely used for presenting devices to pick-and-place machines for automatic placement onto printed circuit boards. 

ISHII SANGYO K.K is the leading company of Embossed carrier tape.

Wafer Package System

i-SIX (S) PTE.LTD
57 Ubi Ave 1 #06-15 Ubi Centre Singapore 408936
Tel:(65) 6788 5296
Fax:(65) 6788 5295
E-mail: sales@i-six.com.sg

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Achilles Wafer Package System, developed making good use of Achilles's plastics processing technologies (injection forming, film processing, foam processing, conductive processing, etc.), can transfer/transport your wafers both safely and efficiently.

i-SIX (S) PTE. LTD. is one of the distributor of Achilles products.

HWS Wafer Package System

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HWS

HWS stands for Horizontal Wafer Shipper, and is a generic name for wafer containers.

Wafer are horizontally stacked up to 25 pieces using spacers and cushions into HWS.

Protos Carrier

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Product Name : Protos Carrier MA Series

Product No : MA-4/5/6S/8/8S/12

Resitance : <1.0 x 106Ω

Material : Conductive PP

Features :

・Compact design to save transportation cost

・Good airtight container

・Industry standard wafer size available

・Feasible design for automated handling machine

Product No.  「H」Container                「h」Effective                  「D」Effective                  「A」Effective
                       height(mm)                     height(mm)                      height(mm)                      height(mm) 

                                      

                                                       


                             

MA-4                       90                                             47.8                                                103±1                                        150

MA-5                       90                                              50                                                   128±1                                        150

MA-6S                    63                                              38                                                    153±1                                       175

MA-8                       103                                            54                                                    203±1                                      226

MA-8S                    65                                             38                                                     203±1                                      226

MA-12                      76                                             44                                                    302±1                                       328

Protos Cushion

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Antistatic multi-layer cushion (highly clean type)

Product Name : Protos Cushion Type PEAS

Product No : MA-☐PEAS-1/3/5/6/10

Resitance : <1.0 x 1012Ω

Material : PE

Features :

・Stable antistatic performance

・Cleanliness

(Independent foaming/Surface film lamination)

・Good impact absorption

☐=Wafer size in inch

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Conductive single-layer cushion

Product Name : Protos Cushion Type PESD

Product No : MA-☐PESD-1/3/5/10

Resitance : <1.0 x 108Ω

Material : PE

Features :

・Low contamination (Independent foaming)

・Low out gassing and Low out ion contamination

・Good impact absorption

・Stable conductive performance

☐=Wafer size in inch

Protos Spacer (Inter leaf)

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Antistatic film spacer

Product Name : Protos Spacer Type PEA

Product No : PEA-☐-350(Z1)

Emboss Thickness : 350μm

Resitance : <1.0 x 1012Ω

Material : Antistatic PE

Features :

・Stable antistatic performance

・Low particle level

・Low ion contamination

・Both sides of spacer have the same surface pattern

☐=Wafer size in inch

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Conductive film spacer

Product Name : Protos Spacer Type CPS

Product No : CPS-☐-250

Emboss Thickness : 250μm

Resitance : <1.0 x 108Ω

Material : Conductive PE

Features :

・Stable conductive performance

・Low particle level

・Low ion contamination

・Both sides of spacer have the same surface pattern

☐=Wafer size in inch